Hackers donate 90% of profit to charity 2019/06/13

NGI Zero awarded two EC research and innovation actions 2018/12/01

EC publishes study on Next Generation Internet 2025 2018/10/05

Bob Goudriaan successor of Marc Gauw 2017/10/12

NLnet Labs' Jaap Akkerhuis inducted in Internet Hall of Fame 2017/09/19


Libre Silicon compiler

[Libre Silicon compiler]

LibreSilicon Compiler (LSC) is a place + route suite for silicon. The main focus of this project is to produce legal and efficient silicon layouts from digital netlists (e. g. BLIF, EDIF). Traditionally the placement and routing problem are handled separately and in sequence and the final layout is given by the routing step. In this setup the routing step gains information from placement but not the other way around. LSC attempts to shift this paradigm to create a feedback loop between the two main problems to improve the solution. Furthermore we are incorporating formal methods to produce the compiler software and to verify resulting layouts. While the latter is standard practice, proving properties of the compiler software itself is only widespread in the domain of software compilers. This exercise will be favored by the use of the programming language Haskell and advanced theorem provers. Finally this software aims to profit from explicit module hierarchies given by the developers of digital logic in register-transfer level (e. g. Verilog, Chisel). Greedy solutions can be found for highly modularised chips: when logic is not inlined in the conventional software compiler sense, the size of problem instances is kept small. This also gives parallelism for free, as the dependency tree is resolved from the bottom up.

Logo NLnet: abstract logo of four people seen from above Logo NGI Zero: letterlogo shaped like a tag

This project was funded through the NGI0 PET Fund, a fund established by NLnet with financial support from the European Commission's Next Generation Internet programme, under the aegis of DG Communications Networks, Content and Technology under grant agreement No 825310. Applications are still open, you can apply today.


Send in your ideas.
Deadline February 1st, 2020.